Sign In | Join Free | My fazendomedia.com
China WUXI WANLI ADHESION MATERIALS CO., LTD. logo
WUXI WANLI ADHESION MATERIALS CO., LTD.
Bond the world together
Verified Supplier

3 Years
Home > Woodworking Hot Melt Adhesive >

Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768

Product Categories
WUXI WANLI ADHESION MATERIALS CO., LTD.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768

Brand Name : WANLI-ADHESION

Model Number : PUR-XBB768

Certification : ISO9001 ISO14001 IATF16949

Place of Origin : CHINA

MOQ : 20 KG

Payment Terms : L/C, T/T

Delivery Time : 5-8 work days

Packaging Details : 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel

Product : PUR Hot Melt Adhesive

Component : PUR(Polyurethane)

Appearance : Ivory White Solid

Solid Content : 100 %

Shelf Life : 6Months

Melt Viscosity : Around 55000mPa·s@ 120℃

Operating Temperature : 120~140℃

Open Time : 8-15s@25℃

Useage Scope : Edge Bonding of Wood Materials-Chip Board

Application Industry : Woodworking Edgebanding

Contact Now

Hot Sale High Quality PUR(Polyurethane) Reactive Hot Melt Adhesive WANLI® PUR-XBB768 with Viscosity About 55000mPa·s@120℃(Brookfield-ASTMD3236) for Edge Bonding of Wood Materials, Foam Boards, And Some Aluminum Substrates Application

Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.

APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

Application Material Woodworking Edgebanding PUR Hot Melt Adhesives
Appearance Ivory White Solid
Component PUR(Polyurethane)
Application Industry Woodworking Edgebanding
Solid Content 100 %
Operating Temperature 120~140℃
Melt Viscosity Around 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time 8-15s@25℃
Usage Scope Edge Bonding of Wood Materials-Chip Board
Shelf Life 6Months
Package 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel


FEATURE
Good initial adhesion.
Suitable opening time.
High bonding strength

USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).

STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.

Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768 Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768


Product Tags:

edgebanding Woodworking Hot Melt Adhesive

      

chip Woodworking Hot Melt Adhesive

      

white pur hot glue

      
Best Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768 wholesale

Chip Edgebanding Woodworking Hot Melt Adhesive White PUR Hot Glue PUR-XBB768 Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: WUXI WANLI ADHESION MATERIALS CO., LTD.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like